immersion gold from China manufacturer - Shenzhen Beyond PCB and PCBA Ltd

Place of Origin:

Guangdong, China (Mainland)


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Product Detail

Number of Layers: 4-Layer

Base Material: FR4

Board Thickness: 0.3-3.2

Min. Line Width: 0.1

Brand Name: beyond

Copper Thickness: 0.5-5.0

Min. Hole Size: 0.03

Min. Line Spacing: 0.1

Base material: FR4, FR1, FR2, CEM-1, CEM-3
Layer:1-12 layer
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce

Base material: FR4, FR1, FR2, CEM-1, CEM-3
Layer:1-12 layer
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers